PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION LAT PLASMA KOREA (PECVD)

BRAND: 

Description of Equipment

Chemical vapor deposition deposits thin films by reacting gases in plasma form. This process is widely used in the semiconductor industry and for MEMS applications.

Service Charge
RM500 per hour (without chemicals and silicone wafer) (depends on recipe)

For further information, kindly reach out our person-in-charge.
MUHAMMAD SULAIMAN BIN MUHAMMAD ZAIN

m.sulaiman@utm.my
07-533 3360

Status :  Available | Unavailable

DISCLAIMER:
1) Basic charge does not include sample preparation, post analysis and consultation
2) Actual charges are subject to the official quotation issued by UIRL laboratory
Effective date: 21 January 2024

Office Address

T03 Building,
University Industry Research Laboratory,
Universiti Teknologi Malaysia,
81310 Skudai,
Johor, Malaysia.

UIRL counter hours

MONDAY – THURSDAY :
8.30am – 12.30pm
2.30pm – 4.30 pm

FRIDAY :
8.30am – 12.30pm
2.30pm – 4.30 pm

Contact us

UIRL Counter :
07-533 3360

Research Ecosystem
Universiti Teknologi Malaysia UTM Nexus - Research & Innovation

Office of Deputy Vice Chancellor (Research & Innovation)

DVCRI Profile Johor Bahru Office Kuala Lumpur Office

Higher Institution Centre of Excellence (HI-COE)

Advance Membrane Technology Research Centre - AMTEC Institute of Noise & Vibration - INV Wireless Communication Centre - WCC

Research Institute

Centre of Excellence (COE)

Institute of High Voltage & High Current - IVAT UTM-MPRC Institue for Oil & Gas - IFOG Centre for Artificial Intelligence & Robotics - CAIRO Centre for Engineering Education - CEE Centre for Advanced Composite Materials - CACM Innovation Centre in Agritechnology for Advanced Bioprocessing - ICA Institute of Bioproduct Development - IBD

Service Entity

Research Management Centre - RMC Penerbit UTM Press Centre for Community & Industry Network - CCIN Innovation & Commercialisation Centre - ICC University Laboratory Management Centre - PPMU Institut Sultan Iskandar - UTM-ISI

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